XLF208-256-FB236-I10

Manufacturer :

XMOS

Product Category :

Microcontrollers

Core Size :

32-Bit 8-Core

Memory Type :

Flash

Packaging :

Tray

Core Processor :

XCore

RoHS Status :

ROHS3 Compliant

Voltage - Supply (Vcc/Vdd) :

0.95V~3.6V

Oscillator Type :

External

Supplier Device Package :

236-FBGA (10x10)

Program Memory Size :

1MB 1M x 8

Number of Pins :

236

Factory Lead Time :

12 Weeks

Published :

2015

Max Operating Temperature :

85°C

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM Size :

256K x 8

Operating Temperature :

-40°C~85°C TA

Program Memory Type :

Flash

Package / Case :

236-LFBGA

Min Operating Temperature :

-40°C

Mounting Type :

Surface Mount

Series :

XLF

Core Architecture :

XCore

Memory Size :

1Mb

Speed :

1000MIPS

Number of I/O :

128