XCZU9EG-L2FFVB1156E

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Mfr.Part #
XCZU9EG-L2FFVB1156E
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1156FCBGA
Stock
11,573
In Stock :
11,573

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Peripherals :
DMA, WDT
HTS Code :
8542.31.00.01
Additional Feature :
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Surface Mount :
yes
Primary Attributes :
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Supply Voltage :
0.72V
Speed :
533MHz, 600MHz, 1.3GHz
Terminal Form :
Ball
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture :
MCU, FPGA
RoHS Status :
ROHS3 Compliant
Number of I/O :
328
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature :
0°C~100°C TJ
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
RAM Size :
256KB
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
JESD-30 Code :
R-PBGA-B1156
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
Supply Voltage-Min (Vsup) :
0.698V
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Supply Voltage-Max (Vsup) :
0.742V
Terminal Position :
BOTTOM
Package / Case :
1156-BBGA, FCBGA
Packaging :
Bulk
Series :
Zynq® UltraScale+™ MPSoC EG
Published :
2013
Introducing System On Chip (SoC) AMD Xilinx XCZU9EG-L2FFVB1156E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Package / Case:1156-BBGA, FCBGA, XCZU9EG-L2FFVB1156E pinout, XCZU9EG-L2FFVB1156E datasheet PDF, XCZU9EG-L2FFVB1156E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU9EG-L2FFVB1156E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU9EG-L2FFVB1156E


0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 328 I/O 0.72V

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


There are Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processors in this SoC.This system on a chip is packaged as 1156-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+™ MPSoC EG series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 599K+ Logic Cells.In the state-of-the-art Bulk package, this SoC system on a chip is housed.This SoC part has a total of 328 I/Os.A power supply with a 0.72V rating is recommended.There is no safe voltage for the SoCs wireless above 0.742V.Power supply should be at least 0.698V.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU9EG-L2FFVB1156E System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
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