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XCZU11EG-2FFVC1760E

XCZU11EG-2FFVC1760E

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Mfr.Part #
XCZU11EG-2FFVC1760E
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1760FCBGA
Stock
11,802
In Stock ：
11,802

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Series :
Zynq® UltraScale+™ MPSoC EG
Primary Attributes :
Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Peripherals :
DMA, WDT
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Operating Temperature :
0°C~100°C TJ
HTS Code :
8542.31.00.01
RoHS Status :
ROHS3 Compliant
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
RAM Size :
256KB
Package / Case :
1760-BBGA, FCBGA
Published :
2016
Speed :
533MHz, 600MHz, 1.3GHz
Factory Lead Time :
11 Weeks
Packaging :
Tray
Number of I/O :
512
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture :
MCU, FPGA
Pbfree Code :
yes
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Introducing System On Chip (SoC) AMD Xilinx XCZU11EG-2FFVC1760E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：1760-BBGA, FCBGA, XCZU11EG-2FFVC1760E pinout, XCZU11EG-2FFVC1760E datasheet PDF, XCZU11EG-2FFVC1760E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU11EG-2FFVC1760E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 512 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC is built.Package 1760-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ MPSoC EG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 653K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.512 I/Os are included in this SoC part.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU11EG-2FFVC1760E System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
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