XCZU9EG-L1FFVC900I

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Mfr.Part #
XCZU9EG-L1FFVC900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 900FCBGA
Stock
41,996
In Stock :
41,996

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Architecture :
MCU, FPGA
Supply Voltage-Max (Vsup) :
0.742V
Supply Voltage-Min (Vsup) :
0.698V
Number of I/O :
204
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Primary Attributes :
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
HTS Code :
8542.31.00.01
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature :
-40°C~100°C TJ
Supply Voltage :
0.72V
Package / Case :
900-BBGA, FCBGA
JESD-30 Code :
R-PBGA-B900
Number of Terminations :
900
RoHS Status :
ROHS3 Compliant
Series :
Zynq® UltraScale+™ MPSoC EG
Packaging :
Tray
Terminal Position :
BOTTOM
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Surface Mount :
yes
Published :
2013
RAM Size :
256KB
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Form :
Ball
Peripherals :
DMA, WDT
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Factory Lead Time :
11 Weeks
Additional Feature :
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Speed :
500MHz, 600MHz, 1.2GHz
Introducing System On Chip (SoC) AMD Xilinx XCZU9EG-L1FFVC900I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:900-BBGA, FCBGA, Number of Terminations:900, XCZU9EG-L1FFVC900I pinout, XCZU9EG-L1FFVC900I datasheet PDF, XCZU9EG-L1FFVC900I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU9EG-L1FFVC900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU9EG-L1FFVC900I


900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O 0.72V

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC is built.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ MPSoC EG.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 599K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.204 I/Os are included in this SoC part.A 0.72V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.At least 0.698V can be supplied as a power source.In total, there are 900 terminations, which makes system on a chip possible.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Aside from that, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU9EG-L1FFVC900I System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
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