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    Mfr.Part #
    XCZU9EG-L1FFVB1156I
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    25,447
    In Stock ：
    25,447

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Published :
    2013
    Package / Case :
    1156-BBGA, FCBGA
    Number of I/O :
    328
    Additional Feature :
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Terminal Form :
    Ball
    Supply Voltage-Min (Vsup) :
    0.698V
    JESD-30 Code :
    R-PBGA-B1156
    Supply Voltage :
    0.72V
    RoHS Status :
    ROHS3 Compliant
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Peripherals :
    DMA, WDT
    Speed :
    500MHz, 600MHz, 1.2GHz
    Supply Voltage-Max (Vsup) :
    0.742V
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
    Operating Temperature :
    -40°C~100°C TJ
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    HTS Code :
    8542.31.00.01
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Factory Lead Time :
    11 Weeks
    Architecture :
    MCU, FPGA
    Terminal Position :
    BOTTOM
    RAM Size :
    256KB
    Surface Mount :
    yes
    Packaging :
    Bulk
    Introducing System On Chip (SoC) AMD Xilinx XCZU9EG-L1FFVB1156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1156-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XCZU9EG-L1FFVB1156I pinout, XCZU9EG-L1FFVB1156I datasheet PDF, XCZU9EG-L1FFVB1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU9EG-L1FFVB1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU9EG-L1FFVB1156I


    -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 328 I/O 0.72V

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 1156-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 599K+ Logic Cells.It comes in a state-of-the-art Bulk package.Total I/Os on this SoC part are 328.A 0.72V power supply should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.698V.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.The SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY, which are additional features.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


    There are a lot of Xilinx Inc.


    XCZU9EG-L1FFVB1156I System On Chip (SoC) applications.


    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
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