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  6. XCZU9CG-L2FFVC900E
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    Mfr.Part #
    XCZU9CG-L2FFVC900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    13,196
    In Stock ：
    13,196

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Peripherals :
    DMA, WDT
    Supply Voltage-Max (Vsup) :
    0.742V
    Supply Voltage-Min (Vsup) :
    0.698V
    HTS Code :
    8542.31.00.01
    Packaging :
    Bulk
    Additional Feature :
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Architecture :
    MCU, FPGA
    Surface Mount :
    yes
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Package / Case :
    900-BBGA, FCBGA
    JESD-30 Code :
    R-PBGA-B900
    Factory Lead Time :
    11 Weeks
    Operating Temperature :
    0°C~100°C TJ
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Supply Voltage :
    0.72V
    RoHS Status :
    ROHS3 Compliant
    Number of Terminations :
    900
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Published :
    2016
    Terminal Form :
    Ball
    Speed :
    533MHz, 1.3GHz
    RAM Size :
    256KB
    Number of I/O :
    204
    Terminal Position :
    BOTTOM
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Introducing System On Chip (SoC) AMD Xilinx XCZU9CG-L2FFVC900E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：900-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, Number of Terminations：900, XCZU9CG-L2FFVC900E pinout, XCZU9CG-L2FFVC900E datasheet PDF, XCZU9CG-L2FFVC900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU9CG-L2FFVC900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU9CG-L2FFVC900E


    900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O 0.72V

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC is built.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ MPSoC CG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 599K+ Logic Cells.A state-of-the-art Bulk package houses this SoC system on a chip.204 I/Os are included in this SoC part.A 0.72V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.At least 0.698V can be supplied as a power source.In total, there are 900 terminations, which makes system on a chip possible.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Aside from that, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


    There are a lot of Xilinx Inc.


    XCZU9CG-L2FFVC900E System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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