XCZU9CG-L1FFVB1156I

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Mfr.Part #
XCZU9CG-L1FFVB1156I
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1156FCBGA
Stock
480
In Stock :
480

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals :
DMA, WDT
JESD-30 Code :
R-PBGA-B1156
Packaging :
Bulk
Speed :
500MHz, 1.2GHz
Primary Attributes :
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Number of I/O :
328
Terminal Form :
Ball
Core Processor :
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Supply Voltage-Max (Vsup) :
0.742V
Package / Case :
1156-BBGA, FCBGA
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Supply Voltage :
0.72V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Surface Mount :
yes
Factory Lead Time :
11 Weeks
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Operating Temperature :
-40°C~100°C TJ
HTS Code :
8542.31.00.01
RAM Size :
256KB
Terminal Position :
BOTTOM
Series :
Zynq® UltraScale+™ MPSoC CG
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Published :
2016
Additional Feature :
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Architecture :
MCU, FPGA
RoHS Status :
ROHS3 Compliant
Supply Voltage-Min (Vsup) :
0.698V
Introducing System On Chip (SoC) AMD Xilinx XCZU9CG-L1FFVB1156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1156-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, XCZU9CG-L1FFVB1156I pinout, XCZU9CG-L1FFVB1156I datasheet PDF, XCZU9CG-L1FFVB1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU9CG-L1FFVB1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU9CG-L1FFVB1156I


-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 328 I/O 0.72V

This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.There is a 1156-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+™ MPSoC CG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 599K+ Logic Cells.There is a state-of-the-art Bulk package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 328 inputs and outputs.Ideally, a power supply with a voltage of 0.72V should be used.An excessive voltage of 0.742V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 0.698V, it should be able to function.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.Aside from that, this SoC processor is also equipped with some additional features that are present in ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU9CG-L1FFVB1156I System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control
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