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    Mfr.Part #
    XCZU9CG-2FFVC900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    32,243
    In Stock ：
    32,243

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Number of I/O :
    204
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    RoHS Status :
    ROHS3 Compliant
    Factory Lead Time :
    11 Weeks
    Pbfree Code :
    yes
    Peripherals :
    DMA, WDT
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    RAM Size :
    256KB
    Packaging :
    Tray
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Package / Case :
    900-BBGA, FCBGA
    Published :
    2013
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
    Architecture :
    MCU, FPGA
    HTS Code :
    8542.31.00.01
    Operating Temperature :
    0°C~100°C TJ
    Speed :
    533MHz, 1.3GHz
    Datasheets
    XCZU9CG-2FFVC900E
    Introducing System On Chip (SoC) AMD Xilinx XCZU9CG-2FFVC900E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：900-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, XCZU9CG-2FFVC900E pinout, XCZU9CG-2FFVC900E datasheet PDF, XCZU9CG-2FFVC900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU9CG-2FFVC900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU9CG-2FFVC900E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    A core processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ is embedded in this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq® UltraScale+™ MPSoC CG is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines Zynq®UltraScale+™ FPGA, 599K+ Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 204 I/Os in total.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU9CG-2FFVC900E System On Chip (SoC) applications.


    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
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