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    Mfr.Part #
    XCZU9CG-1FFVB1156I
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    665
    In Stock ：
    665

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Architecture :
    MCU, FPGA
    RoHS Status :
    ROHS3 Compliant
    Number of I/O :
    328
    Factory Lead Time :
    11 Weeks
    RAM Size :
    256KB
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Packaging :
    Tray
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Package / Case :
    1156-BBGA, FCBGA
    Speed :
    500MHz, 1.2GHz
    Series :
    Zynq® UltraScale+™ MPSoC CG
    HTS Code :
    8542.31.00.01
    Operating Temperature :
    -40°C~100°C TJ
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Peripherals :
    DMA, WDT
    Published :
    2013
    Introducing System On Chip (SoC) AMD Xilinx XCZU9CG-1FFVB1156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1156-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XCZU9CG-1FFVB1156I pinout, XCZU9CG-1FFVB1156I datasheet PDF, XCZU9CG-1FFVB1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU9CG-1FFVB1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU9CG-1FFVB1156I


    -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 328 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    A core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 1156-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq® UltraScale+™ MPSoC CG is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq®UltraScale+™ FPGA, 599K+ Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.328 I/Os are available in this SoC part.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU9CG-1FFVB1156I System On Chip (SoC) applications.


    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
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