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    Mfr.Part #
    XCZU9CG-1FFVB1156E
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    332
    In Stock ：
    332

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Packaging :
    Tray
    Operating Temperature :
    0°C~100°C TJ
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Package / Case :
    1156-BBGA, FCBGA
    Number of I/O :
    328
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Published :
    2013
    RAM Size :
    256KB
    RoHS Status :
    ROHS3 Compliant
    Factory Lead Time :
    11 Weeks
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Architecture :
    MCU, FPGA
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
    Speed :
    500MHz, 1.2GHz
    Peripherals :
    DMA, WDT
    HTS Code :
    8542.31.00.01
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Introducing System On Chip (SoC) AMD Xilinx XCZU9CG-1FFVB1156E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：1156-BBGA, FCBGA, XCZU9CG-1FFVB1156E pinout, XCZU9CG-1FFVB1156E datasheet PDF, XCZU9CG-1FFVB1156E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU9CG-1FFVB1156E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU9CG-1FFVB1156E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 328 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC is built.Package 1156-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ MPSoC CG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 599K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.328 I/Os are included in this SoC part.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU9CG-1FFVB1156E System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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