XCZU7EV-L1FBVB900I
- Mfr.Part #
- XCZU7EV-L1FBVB900I
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A53 900FCBGA
- Stock
- 29,436
- In Stock :
- 29,436
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Factory Lead Time :
- 11 Weeks
- Speed :
- 500MHz, 600MHz, 1.2GHz
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes :
- Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Published :
- 2016
- RAM Size :
- 256KB
- Additional Feature :
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- Terminal Position :
- BOTTOM
- RoHS Status :
- ROHS3 Compliant
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Form :
- Ball
- Peripherals :
- DMA, WDT
- Packaging :
- Tray
- HTS Code :
- 8542.31.00.01
- Surface Mount :
- yes
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Architecture :
- MCU, FPGA
- Supply Voltage :
- 0.72V
- Supply Voltage-Max (Vsup) :
- 0.742V
- JESD-30 Code :
- R-PBGA-B900
- Number of I/O :
- 204
- Supply Voltage-Min (Vsup) :
- 0.698V
- Number of Terminations :
- 900
- Package / Case :
- 900-BBGA, FCBGA
- Series :
- Zynq® UltraScale+™ MPSoC EV
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Operating Temperature :
- -40°C~100°C TJ
- Datasheets
- XCZU7EV-L1FBVB900I

900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 204 I/O 0.72V
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is embedded in this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq® UltraScale+™ MPSoC EV is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Zynq®UltraScale+™ FPGA, 504K+ Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 204 I/Os in total.A power supply with a 0.72V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 0.742V.As a minimum, the power supply of the SoC system on a chip needs to be 0.698V.As a result, there are 900 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.Moreover, this SoC processor is also equipped with additional features of ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU7EV-L1FBVB900I System On Chip (SoC) applications.
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
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