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    Mfr.Part #
    XCZU7EV-2FFVC1156I
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    31
    In Stock ：
    31

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Architecture :
    MCU, FPGA
    Number of I/O :
    360
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Packaging :
    Tray
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    RoHS Status :
    ROHS3 Compliant
    Speed :
    533MHz, 600MHz, 1.3GHz
    Series :
    Zynq® UltraScale+™ MPSoC EV
    Package / Case :
    1156-BBGA, FCBGA
    Factory Lead Time :
    11 Weeks
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
    Operating Temperature :
    -40°C~100°C TJ
    HTS Code :
    8542.31.00.01
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Peripherals :
    DMA, WDT
    RAM Size :
    256KB
    Published :
    2016
    Introducing System On Chip (SoC) AMD Xilinx XCZU7EV-2FFVC1156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1156-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XCZU7EV-2FFVC1156I pinout, XCZU7EV-2FFVC1156I datasheet PDF, XCZU7EV-2FFVC1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU7EV-2FFVC1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU7EV-2FFVC1156I


    -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 360 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    There are Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processors in this SoC.This system on a chip is packaged as 1156-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+™ MPSoC EV series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 504K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 360 I/Os.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU7EV-2FFVC1156I System On Chip (SoC) applications.


    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
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