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  6. XCZU7EV-1FBVB900I
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    Mfr.Part #
    XCZU7EV-1FBVB900I
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    2
    In Stock ：
    2

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Architecture :
    MCU, FPGA
    HTS Code :
    8542.31.00.01
    Operating Temperature :
    -40°C~100°C TJ
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Peripherals :
    DMA, WDT
    Speed :
    500MHz, 600MHz, 1.2GHz
    Packaging :
    Tray
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Package / Case :
    900-BBGA, FCBGA
    Factory Lead Time :
    11 Weeks
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
    Number of I/O :
    204
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    RoHS Status :
    ROHS3 Compliant
    Series :
    Zynq® UltraScale+™ MPSoC EV
    Published :
    2016
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    RAM Size :
    256KB
    Datasheets
    XCZU7EV-1FBVB900I
    Introducing System On Chip (SoC) AMD Xilinx XCZU7EV-1FBVB900I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~100°C TJ, Package / Case：900-BBGA, FCBGA, XCZU7EV-1FBVB900I pinout, XCZU7EV-1FBVB900I datasheet PDF, XCZU7EV-1FBVB900I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU7EV-1FBVB900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU7EV-1FBVB900I


    -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 204 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is embedded in this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq® UltraScale+™ MPSoC EV is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Zynq®UltraScale+™ FPGA, 504K+ Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 204 I/Os in total.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU7EV-1FBVB900I System On Chip (SoC) applications.


    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
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