XCZU7CG-2FFVF1517I

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Mfr.Part #
XCZU7CG-2FFVF1517I
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1517FCBGA
Stock
26,413
In Stock :
26,413

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Packaging :
Tray
Surface Mount :
yes
HTS Code :
8542.31.00.01
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Core Processor :
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed :
533MHz, 1.3GHz
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RoHS Status :
ROHS3 Compliant
Factory Lead Time :
11 Weeks
Published :
2016
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
JESD-30 Code :
R-PBGA-B1517
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Peripherals :
DMA, WDT
Architecture :
MCU, FPGA
Operating Temperature :
-40°C~100°C TJ
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage-Max (Vsup) :
0.876V
Number of I/O :
464
Series :
Zynq® UltraScale+™ MPSoC CG
Package / Case :
1517-BBGA, FCBGA
Supply Voltage-Min (Vsup) :
0.825V
Supply Voltage :
0.85V
RAM Size :
256KB
Primary Attributes :
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Terminal Position :
BOTTOM
Introducing System On Chip (SoC) AMD Xilinx XCZU7CG-2FFVF1517I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:1517-BBGA, FCBGA, XCZU7CG-2FFVF1517I pinout, XCZU7CG-2FFVF1517I datasheet PDF, XCZU7CG-2FFVF1517I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU7CG-2FFVF1517I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU7CG-2FFVF1517I


-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 464 I/O 0.85V

This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC is built.Package 1517-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ MPSoC CG.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 504K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.464 I/Os are included in this SoC part.A 0.85V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 0.876V.At least 0.825V can be supplied as a power source.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU7CG-2FFVF1517I System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
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