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  6. XCZU6EG-L2FFVB1156E
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    Mfr.Part #
    XCZU6EG-L2FFVB1156E
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    30,435
    In Stock ：
    30,435

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Packaging :
    Tray
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed :
    533MHz, 600MHz, 1.3GHz
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
    Surface Mount :
    yes
    RoHS Status :
    ROHS3 Compliant
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Architecture :
    MCU, FPGA
    Number of I/O :
    328
    Supply Voltage-Min (Vsup) :
    0.698V
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Supply Voltage :
    0.72V
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    JESD-30 Code :
    R-PBGA-B1156
    Terminal Position :
    BOTTOM
    Peripherals :
    DMA, WDT
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Factory Lead Time :
    11 Weeks
    RAM Size :
    256KB
    Operating Temperature :
    0°C~100°C TJ
    Additional Feature :
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    Terminal Form :
    Ball
    HTS Code :
    8542.31.00.01
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Package / Case :
    1156-BBGA, FCBGA
    Published :
    2016
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Supply Voltage-Max (Vsup) :
    0.742V
    Introducing System On Chip (SoC) AMD Xilinx XCZU6EG-L2FFVB1156E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：1156-BBGA, FCBGA, XCZU6EG-L2FFVB1156E pinout, XCZU6EG-L2FFVB1156E datasheet PDF, XCZU6EG-L2FFVB1156E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU6EG-L2FFVB1156E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU6EG-L2FFVB1156E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 328 I/O 0.72V

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    There are Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processors in this SoC.This system on a chip is packaged as 1156-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+™ MPSoC EG series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 328 I/Os.A power supply with a 0.72V rating is recommended.There is no safe voltage for the SoCs wireless above 0.742V.Power supply should be at least 0.698V.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


    There are a lot of Xilinx Inc.


    XCZU6EG-L2FFVB1156E System On Chip (SoC) applications.


    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
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