XCZU6EG-L1FFVB1156I

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Mfr.Part #
XCZU6EG-L1FFVB1156I
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1156FCBGA
Stock
8,438
In Stock :
8,438

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Terminal Position :
BOTTOM
Operating Temperature :
-40°C~100°C TJ
Supply Voltage-Max (Vsup) :
0.742V
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Number of I/O :
328
HTS Code :
8542.31.00.01
Package / Case :
1156-BBGA, FCBGA
Terminal Form :
Ball
RAM Size :
256KB
Published :
2016
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Supply Voltage-Min (Vsup) :
0.698V
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RoHS Status :
ROHS3 Compliant
Factory Lead Time :
11 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Speed :
500MHz, 600MHz, 1.2GHz
Peripherals :
DMA, WDT
Primary Attributes :
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Packaging :
Tray
Architecture :
MCU, FPGA
Series :
Zynq® UltraScale+™ MPSoC EG
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Surface Mount :
yes
Additional Feature :
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage :
0.72V
JESD-30 Code :
R-PBGA-B1156
Introducing System On Chip (SoC) AMD Xilinx XCZU6EG-L1FFVB1156I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:1156-BBGA, FCBGA, XCZU6EG-L1FFVB1156I pinout, XCZU6EG-L1FFVB1156I datasheet PDF, XCZU6EG-L1FFVB1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU6EG-L1FFVB1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU6EG-L1FFVB1156I


-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 328 I/O 0.72V

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


There are Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processors in this SoC.This system on a chip is packaged as 1156-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+™ MPSoC EG series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 328 I/Os.A power supply with a 0.72V rating is recommended.There is no safe voltage for the SoCs wireless above 0.742V.Power supply should be at least 0.698V.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU6EG-L1FFVB1156I System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
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