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    Mfr.Part #
    XCZU6EG-2FFVB1156I
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    16,751
    In Stock ：
    16,751

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    RoHS Status :
    ROHS3 Compliant
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Speed :
    533MHz, 600MHz, 1.3GHz
    Number of I/O :
    328
    HTS Code :
    8542.31.00.01
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Package / Case :
    1156-BBGA, FCBGA
    Peripherals :
    DMA, WDT
    Architecture :
    MCU, FPGA
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Operating Temperature :
    -40°C~100°C TJ
    Factory Lead Time :
    11 Weeks
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Packaging :
    Tray
    RAM Size :
    256KB
    Introducing System On Chip (SoC) AMD Xilinx XCZU6EG-2FFVB1156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1156-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XCZU6EG-2FFVB1156I pinout, XCZU6EG-2FFVB1156I datasheet PDF, XCZU6EG-2FFVB1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU6EG-2FFVB1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU6EG-2FFVB1156I


    -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 328 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells.Housed in the state-of-art Tray package.328 I/Os in total are included in this SoC part.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU6EG-2FFVB1156I System On Chip (SoC) applications.


    • Automotive gateway
    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
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