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  6. XCZU6EG-1FFVC900E
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    Mfr.Part #
    XCZU6EG-1FFVC900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    46,890
    In Stock ：
    46,890

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Number of I/O :
    204
    Packaging :
    Tray
    Published :
    2016
    RAM Size :
    256KB
    Speed :
    500MHz, 600MHz, 1.2GHz
    Series :
    Zynq® UltraScale+™ MPSoC EG
    RoHS Status :
    ROHS3 Compliant
    HTS Code :
    8542.31.00.01
    Architecture :
    MCU, FPGA
    Package / Case :
    900-BBGA, FCBGA
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Factory Lead Time :
    11 Weeks
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
    Peripherals :
    DMA, WDT
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Operating Temperature :
    0°C~100°C TJ
    Datasheets
    XCZU6EG-1FFVC900E
    Introducing System On Chip (SoC) AMD Xilinx XCZU6EG-1FFVC900E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：900-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, XCZU6EG-1FFVC900E pinout, XCZU6EG-1FFVC900E datasheet PDF, XCZU6EG-1FFVC900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU6EG-1FFVC900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU6EG-1FFVC900E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O

    XCZU6EG-1FFVC900E Description

     

    XCZU6EG-1FFVC900E core processor(s) are used in the construction of this SoC.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer. As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users. In terms of internal architecture, this SoC design uses the MCU, FPGA method. In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included. It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells and that is something to note. It comes in a state-of-the-art Tray package. This SoC part has a total of 204 I/Os.

    XCZU6EG-1FFVC900E Features


    Reliable performance

    256KB RAM.
    Built on MCU, FPGA.

    There are a lot of Xilinx Inc.


    XCZU6EG-1FFVC900E System On Chip (SoC) applications.

    • Medical

    • PC peripherals

    • Cyberphysical system-on-chip

    • High-end PLC

    • AC drive control module

    • Fitness

    • Sports

    • Industrial automation devices

    • ARM Cortex M4 microcontroller

    • Sensor network-on-chip (sNoC)

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