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  6. XCZU6CG-L2FFVC900E
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    Mfr.Part #
    XCZU6CG-L2FFVC900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    6,932
    In Stock ：
    6,932

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Terminal Position :
    BOTTOM
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Additional Feature :
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    RAM Size :
    256KB
    Supply Voltage-Min (Vsup) :
    0.698V
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Package / Case :
    900-BBGA, FCBGA
    Architecture :
    MCU, FPGA
    Number of I/O :
    204
    Published :
    2016
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Terminal Form :
    Ball
    Factory Lead Time :
    11 Weeks
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    HTS Code :
    8542.31.00.01
    JESD-30 Code :
    R-PBGA-B900
    Operating Temperature :
    0°C~100°C TJ
    RoHS Status :
    ROHS3 Compliant
    Number of Terminations :
    900
    Surface Mount :
    yes
    Supply Voltage-Max (Vsup) :
    0.742V
    Speed :
    533MHz, 1.3GHz
    Packaging :
    Tray
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Supply Voltage :
    0.72V
    Peripherals :
    DMA, WDT
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Introducing System On Chip (SoC) AMD Xilinx XCZU6CG-L2FFVC900E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：900-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, Number of Terminations：900, XCZU6CG-L2FFVC900E pinout, XCZU6CG-L2FFVC900E datasheet PDF, XCZU6CG-L2FFVC900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU6CG-L2FFVC900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU6CG-L2FFVC900E


    900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O 0.72V

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    A core processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ is embedded in this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq® UltraScale+™ MPSoC CG is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 204 I/Os in total.A power supply with a 0.72V voltage rating should be utilized when using this system on chip SoC.It is considered hazardous to operate the SoCs wireless with a voltage higher than 0.742V.As a minimum, the power supply of the SoC system on a chip needs to be 0.698V.As a result, there are 900 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.Moreover, this SoC processor is also equipped with additional features of ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


    There are a lot of Xilinx Inc.


    XCZU6CG-L2FFVC900E System On Chip (SoC) applications.


    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
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