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    Mfr.Part #
    XCZU6CG-2FFVB1156I
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    19,391
    In Stock ：
    19,391

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    JESD-30 Code :
    R-PBGA-B1156
    Number of I/O :
    328
    Peripherals :
    DMA, WDT
    Surface Mount :
    yes
    Packaging :
    Bulk
    Supply Voltage-Min (Vsup) :
    0.825V
    HTS Code :
    8542.31.00.01
    Package / Case :
    1156-BBGA, FCBGA
    Terminal Position :
    BOTTOM
    Terminal Form :
    Ball
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
    Factory Lead Time :
    11 Weeks
    RoHS Status :
    ROHS3 Compliant
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Speed :
    533MHz, 1.3GHz
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Published :
    2016
    Operating Temperature :
    -40°C~100°C TJ
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Architecture :
    MCU, FPGA
    Supply Voltage-Max (Vsup) :
    0.876V
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Supply Voltage :
    0.85V
    RAM Size :
    256KB
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Introducing System On Chip (SoC) AMD Xilinx XCZU6CG-2FFVB1156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1156-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XCZU6CG-2FFVB1156I pinout, XCZU6CG-2FFVB1156I datasheet PDF, XCZU6CG-2FFVB1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU6CG-2FFVB1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU6CG-2FFVB1156I


    -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 328 I/O 0.85V

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    A core processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ is used to build this SoC.Its package is 1156-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC CG series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells.It comes in a state-of-the-art Bulk package.Total I/Os on this SoC part are 328.A 0.85V power supply should be used.There are voltages higher than 0.876V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.825V.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT


    There are a lot of Xilinx Inc.


    XCZU6CG-2FFVB1156I System On Chip (SoC) applications.


    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
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