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    Mfr.Part #
    XCZU6CG-2FFVB1156E
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    30,891
    In Stock ：
    30,891

    Request A Quote(RFQ)

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    * Quantity:
    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Packaging :
    Bulk
    Pbfree Code :
    yes
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Factory Lead Time :
    11 Weeks
    Speed :
    533MHz, 1.3GHz
    HTS Code :
    8542.31.00.01
    Peripherals :
    DMA, WDT
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Published :
    2016
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    RoHS Status :
    ROHS3 Compliant
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Number of I/O :
    328
    Package / Case :
    1156-BBGA, FCBGA
    Operating Temperature :
    0°C~100°C TJ
    RAM Size :
    256KB
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
    Architecture :
    MCU, FPGA
    Introducing System On Chip (SoC) AMD Xilinx XCZU6CG-2FFVB1156E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1156-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, XCZU6CG-2FFVB1156E pinout, XCZU6CG-2FFVB1156E datasheet PDF, XCZU6CG-2FFVB1156E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU6CG-2FFVB1156E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU6CG-2FFVB1156E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 328 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC CG series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells together.Bulk package houses this SoC system on a chip.An integral part of this SoC consists of a total of 328 I/Os.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU6CG-2FFVB1156E System On Chip (SoC) applications.


    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
    • Medical
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