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    Mfr.Part #
    XCZU6CG-1FFVB1156E
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 1156FCBGA
    Stock
    4,577
    In Stock ：
    4,577

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    RAM Size :
    256KB
    Speed :
    500MHz, 1.2GHz
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Peripherals :
    DMA, WDT
    Operating Temperature :
    0°C~100°C TJ
    Published :
    2016
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
    Number of I/O :
    328
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Packaging :
    Bulk
    Architecture :
    MCU, FPGA
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    HTS Code :
    8542.31.00.01
    RoHS Status :
    ROHS3 Compliant
    Factory Lead Time :
    11 Weeks
    Package / Case :
    1156-BBGA, FCBGA
    Introducing System On Chip (SoC) AMD Xilinx XCZU6CG-1FFVB1156E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：1156-BBGA, FCBGA, XCZU6CG-1FFVB1156E pinout, XCZU6CG-1FFVB1156E datasheet PDF, XCZU6CG-1FFVB1156E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU6CG-1FFVB1156E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU6CG-1FFVB1156E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 328 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC is built.Package 1156-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ MPSoC CG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 469K+ Logic Cells.A state-of-the-art Bulk package houses this SoC system on a chip.328 I/Os are included in this SoC part.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU6CG-1FFVB1156E System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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