XCZU5EG-L2FBVB900E
- Mfr.Part #
- XCZU5EG-L2FBVB900E
- Manufacturer
- AMD Xilinx
- Package / Case
- 900-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A53 900FCBGA
- Stock
- 30,159
- In Stock :
- 30,159
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Supply Voltage :
- 0.72V
- Number of I/O :
- 204
- Package / Case :
- 900-BBGA, FCBGA
- Supply Voltage-Max (Vsup) :
- 0.742V
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- HTS Code :
- 8542.31.00.01
- Supply Voltage-Min (Vsup) :
- 0.698V
- RAM Size :
- 256KB
- Peripherals :
- DMA, WDT
- Number of Terminations :
- 900
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Terminal Position :
- BOTTOM
- Architecture :
- MCU, FPGA
- Published :
- 2016
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Speed :
- 533MHz, 600MHz, 1.3GHz
- Additional Feature :
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- Primary Attributes :
- Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
- JESD-30 Code :
- R-PBGA-B900
- Terminal Form :
- Ball
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Factory Lead Time :
- 11 Weeks
- Operating Temperature :
- 0°C~100°C TJ
- Series :
- Zynq® UltraScale+™ MPSoC EG
- Surface Mount :
- yes
- RoHS Status :
- ROHS3 Compliant
- Datasheets
- XCZU5EG-L2FBVB900E

900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O 0.72V
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
A core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq® UltraScale+™ MPSoC EG is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Zynq®UltraScale+™ FPGA, 256K+ Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.204 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.72V.The SoCs wireless cannot operate at a voltage greater than 0.742V because it is considered unsafe for the application.If it has at least a 0.698V volt power supply, it can work fine.In total, there are 900 terminations, so system on a chip is really aided by this.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.Moreover, this SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY as its additional features.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU5EG-L2FBVB900E System On Chip (SoC) applications.
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
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