XCZU5CG-L1FBVB900I

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Mfr.Part #
XCZU5CG-L1FBVB900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 900FCBGA
Stock
29,602
In Stock :
29,602

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Speed :
500MHz, 1.2GHz
Operating Temperature :
-40°C~100°C TJ
Peripherals :
DMA, WDT
Number of Terminations :
900
Supply Voltage :
0.72V
Published :
2016
Package / Case :
900-BBGA, FCBGA
RoHS Status :
ROHS3 Compliant
Series :
Zynq® UltraScale+™ MPSoC CG
Surface Mount :
yes
Supply Voltage-Max (Vsup) :
0.742V
Additional Feature :
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Packaging :
Tray
Terminal Position :
BOTTOM
RAM Size :
256KB
Number of I/O :
204
Core Processor :
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
HTS Code :
8542.31.00.01
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Terminal Form :
Ball
Primary Attributes :
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Supply Voltage-Min (Vsup) :
0.698V
Factory Lead Time :
11 Weeks
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Architecture :
MCU, FPGA
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
JESD-30 Code :
R-PBGA-B900
Introducing System On Chip (SoC) AMD Xilinx XCZU5CG-L1FBVB900I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Number of Terminations:900, Package / Case:900-BBGA, FCBGA, XCZU5CG-L1FBVB900I pinout, XCZU5CG-L1FBVB900I datasheet PDF, XCZU5CG-L1FBVB900I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU5CG-L1FBVB900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU5CG-L1FBVB900I


900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O 0.72V

This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


There are Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processors in this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+™ MPSoC CG series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 256K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 204 I/Os.A power supply with a 0.72V rating is recommended.There is no safe voltage for the SoCs wireless above 0.742V.Power supply should be at least 0.698V.It is really beneficial to have system on a chip since there are 900 terminations in total.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU5CG-L1FBVB900I System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
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