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  6. XCZU5CG-1FBVB900E
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    Mfr.Part #
    XCZU5CG-1FBVB900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    11,790
    In Stock ：
    11,790

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    RoHS Status :
    ROHS3 Compliant
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Package / Case :
    900-BBGA, FCBGA
    Packaging :
    Tray
    Published :
    2016
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
    Number of I/O :
    204
    Operating Temperature :
    0°C~100°C TJ
    Factory Lead Time :
    11 Weeks
    Architecture :
    MCU, FPGA
    HTS Code :
    8542.31.00.01
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    RAM Size :
    256KB
    Speed :
    500MHz, 1.2GHz
    Peripherals :
    DMA, WDT
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Datasheets
    XCZU5CG-1FBVB900E
    Introducing System On Chip (SoC) AMD Xilinx XCZU5CG-1FBVB900E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：900-BBGA, FCBGA, Operating Temperature：0°C~100°C TJ, XCZU5CG-1FBVB900E pinout, XCZU5CG-1FBVB900E datasheet PDF, XCZU5CG-1FBVB900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU5CG-1FBVB900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU5CG-1FBVB900E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+™ MPSoC CG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 256K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 204 inputs and outputs.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU5CG-1FBVB900E System On Chip (SoC) applications.


    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
    • Medical
    • Remote control
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