XCZU55DR-2FFVE1156I

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Mfr.Part #
XCZU55DR-2FFVE1156I
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC ZUP RFSOC A53 FPGA 1156BGA
Stock
49,103
In Stock :
49,103

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Number of I/O :
-
Resistance Tolerance :
1
Manufacturer :
Xilinx
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RAM Size :
-
Architecture :
MPU, FPGA
Product Category :
SoC FPGA
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Subcategory :
SOC - Systems on a Chip
Supplier Device Package :
1156-FCBGA (35x35)
Product Status :
Active
Temperature Coefficient :
100.0000 ppm/°C
Brand :
Xilinx
Package / Case :
1156-BBGA, FCBGA
Peripherals :
DDR, DMA, PCIe, WDT
Operating Temperature :
-40°C ~ 100°C (TJ)
Flash Size :
-
Primary Attributes :
Zynq® UltraScale+™ RFSoC
Series :
Zynq® UltraScale+™ RFSoC DR
Package :
Tray
Product Length :
10.8
Speed :
533MHz, 1.3GHz
Resistance :
392 kOhm
Power Rating :
0.25 W
Datasheets
XCZU55DR-2FFVE1156I
Introducing System On Chip (SoC) AMD Xilinx XCZU55DR-2FFVE1156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1156-BBGA, FCBGA, Operating Temperature:-40°C ~ 100°C (TJ), XCZU55DR-2FFVE1156I pinout, XCZU55DR-2FFVE1156I datasheet PDF, XCZU55DR-2FFVE1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU55DR-2FFVE1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU55DR-2FFVE1156I


-40°C ~ 100°C (TJ) System On Chip Zynq® UltraScale+™ RFSoC DR Series - I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


There are Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processors in this SoC.This system on a chip is packaged as 1156-BBGA, FCBGA by the manufacturer.As this SoC chip has - RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MPU, FPGA method.The Zynq® UltraScale+™ RFSoC DR series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C ~ 100°C (TJ) on average.There is one thing to note about this SoC security: it combines Zynq® UltraScale+™ RFSoC.This SoC part has a total of - I/Os.As any high-quality SOC - Systems on a Chip, it is a system on a chip of outstanding capabilities.The flash is set to -.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


- RAM.
Built on MPU, FPGA.
- extended flash.


There are a lot of Xilinx


XCZU55DR-2FFVE1156I System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
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