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    Mfr.Part #
    XCZU4EG-1FBVB900I
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    14,858
    In Stock ：
    14,858

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Number of I/O :
    204
    RAM Size :
    256KB
    Factory Lead Time :
    11 Weeks
    Published :
    2016
    Peripherals :
    DMA, WDT
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
    Speed :
    500MHz, 600MHz, 1.2GHz
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Operating Temperature :
    -40°C~100°C TJ
    Architecture :
    MCU, FPGA
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    RoHS Status :
    ROHS3 Compliant
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    Packaging :
    Tray
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Package / Case :
    900-BBGA, FCBGA
    HTS Code :
    8542.31.00.01
    Datasheets
    XCZU4EG-1FBVB900I
    Introducing System On Chip (SoC) AMD Xilinx XCZU4EG-1FBVB900I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~100°C TJ, Package / Case：900-BBGA, FCBGA, XCZU4EG-1FBVB900I pinout, XCZU4EG-1FBVB900I datasheet PDF, XCZU4EG-1FBVB900I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU4EG-1FBVB900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU4EG-1FBVB900I


    -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O

    XCZU4EG-1FBVB900I Description


    The Zynq® UltraScale+™ MPSoC XCZU4EG-1FBBB900I is based on the Xilinx® UltraScale™ MPSoC architecture. This XCZU4EG-1FBVB900I integrates a feature-rich 64-bit quad-core or dual-core Arm® Cortex®-A53 and dual-core Arm Cortex-R5F based processing system (PS) and Xilinx programmable logic (PL) UltraScale architecture in a single device. Also included are on-chip memory, multiport external memory interfaces, and a rich set of peripheral connectivity interfaces.



    XCZU4EG-1FBVB900I Features


    Arm Cortex-A53 Based Application Processing Unit (APU)

    Dual-core Arm Cortex-R5F Based Real-Time Processing Unit (RPU)

    On-Chip Memory

    Arm Mali-400 Based GPU

    External Memory Interfaces

    8-Channel DMA Controller



    XCZU4EG-1FBVB900I Applications


    Automotive: Driver assistance, driver information, and infotainment

    Wireless Communications: Support for multiple spectral bands and smart antennas

    Wired Communications: Multiple wired communications standards and context-aware network services

    Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics

    Smarter Vision: Evolving video-processing algorithms, object detection, and analytics

    Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safety


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