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  6. XCZU4CG-L2FBVB900E
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    Mfr.Part #
    XCZU4CG-L2FBVB900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    30,238
    In Stock ：
    30,238

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Peripherals :
    DMA, WDT
    RoHS Status :
    ROHS3 Compliant
    Terminal Position :
    BOTTOM
    Factory Lead Time :
    11 Weeks
    Supply Voltage-Min (Vsup) :
    0.698V
    Packaging :
    Tray
    Supply Voltage-Max (Vsup) :
    0.742V
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Package / Case :
    900-BBGA, FCBGA
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Published :
    2016
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Architecture :
    MCU, FPGA
    JESD-30 Code :
    R-PBGA-B900
    HTS Code :
    8542.31.00.01
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
    Additional Feature :
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    Number of Terminations :
    900
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Number of I/O :
    204
    Surface Mount :
    yes
    Supply Voltage :
    0.72V
    Terminal Form :
    Ball
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    RAM Size :
    256KB
    Operating Temperature :
    0°C~100°C TJ
    Speed :
    500MHz, 1.2GHz
    Introducing System On Chip (SoC) AMD Xilinx XCZU4CG-L2FBVB900E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：900-BBGA, FCBGA, Number of Terminations：900, Operating Temperature：0°C~100°C TJ, XCZU4CG-L2FBVB900E pinout, XCZU4CG-L2FBVB900E datasheet PDF, XCZU4CG-L2FBVB900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU4CG-L2FBVB900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU4CG-L2FBVB900E


    900 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O 0.72V

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+™ MPSoC CG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 192K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 204 inputs and outputs.Ideally, a power supply with a voltage of 0.72V should be used.An excessive voltage of 0.742V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 0.698V, it should be able to function.system on a chip benefits from 900 terminations.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.Aside from that, this SoC processor is also equipped with some additional features that are present in ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


    There are a lot of Xilinx Inc.


    XCZU4CG-L2FBVB900E System On Chip (SoC) applications.


    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
    • Medical
    • Remote control
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