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  6. XCZU4CG-L1FBVB900I
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    Mfr.Part #
    XCZU4CG-L1FBVB900I
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    868
    In Stock ：
    868

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    RAM Size :
    256KB
    Supply Voltage-Min (Vsup) :
    0.698V
    Factory Lead Time :
    11 Weeks
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Supply Voltage-Max (Vsup) :
    0.742V
    Terminal Form :
    Ball
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Supply Voltage :
    0.72V
    RoHS Status :
    ROHS3 Compliant
    Peripherals :
    DMA, WDT
    HTS Code :
    8542.31.00.01
    Operating Temperature :
    -40°C~100°C TJ
    JESD-30 Code :
    R-PBGA-B900
    Published :
    2016
    Speed :
    500MHz, 1.2GHz
    Packaging :
    Tray
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Number of I/O :
    204
    Package / Case :
    900-BBGA, FCBGA
    Additional Feature :
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    Architecture :
    MCU, FPGA
    Surface Mount :
    yes
    Terminal Position :
    BOTTOM
    Number of Terminations :
    900
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
    Introducing System On Chip (SoC) AMD Xilinx XCZU4CG-L1FBVB900I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~100°C TJ, Package / Case：900-BBGA, FCBGA, Number of Terminations：900, XCZU4CG-L1FBVB900I pinout, XCZU4CG-L1FBVB900I datasheet PDF, XCZU4CG-L1FBVB900I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU4CG-L1FBVB900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU4CG-L1FBVB900I


    900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O 0.72V

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC is built.Package 900-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ MPSoC CG.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.204 I/Os are included in this SoC part.A 0.72V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.At least 0.698V can be supplied as a power source.In total, there are 900 terminations, which makes system on a chip possible.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Aside from that, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


    There are a lot of Xilinx Inc.


    XCZU4CG-L1FBVB900I System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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