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  6. XCZU4CG-2FBVB900I
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    Mfr.Part #
    XCZU4CG-2FBVB900I
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    15,320
    In Stock ：
    15,320

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
    HTS Code :
    8542.31.00.01
    Supply Voltage-Min (Vsup) :
    0.825V
    Number of I/O :
    204
    Terminal Position :
    BOTTOM
    Published :
    2016
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Speed :
    533MHz, 1.3GHz
    Operating Temperature :
    -40°C~100°C TJ
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Supply Voltage-Max (Vsup) :
    0.876V
    Supply Voltage :
    0.85V
    Peripherals :
    DMA, WDT
    RoHS Status :
    ROHS3 Compliant
    RAM Size :
    256KB
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Surface Mount :
    yes
    Architecture :
    MCU, FPGA
    JESD-30 Code :
    R-PBGA-B900
    uPs/uCs/Peripheral ICs Type :
    MICROPROCESSOR CIRCUIT
    Number of Terminations :
    900
    Factory Lead Time :
    11 Weeks
    Terminal Form :
    Ball
    Package / Case :
    900-BBGA, FCBGA
    Packaging :
    Tray
    Datasheets
    XCZU4CG-2FBVB900I
    Introducing System On Chip (SoC) AMD Xilinx XCZU4CG-2FBVB900I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~100°C TJ, Number of Terminations：900, Package / Case：900-BBGA, FCBGA, XCZU4CG-2FBVB900I pinout, XCZU4CG-2FBVB900I datasheet PDF, XCZU4CG-2FBVB900I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU4CG-2FBVB900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU4CG-2FBVB900I


    900 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O 0.85V

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC CG series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 204 I/Os.For safe operation, it is advisable to utilize a power supply with 0.85V voltage.In the SoCs wireless, high voltages above 0.876V are considered dangerous and should not be used.In order to run it, it must be fed by at least 0.825V of power.The system on a chip uses 900 terminations in total.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    MICROPROCESSOR CIRCUIT


    There are a lot of Xilinx Inc.


    XCZU4CG-2FBVB900I System On Chip (SoC) applications.


    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
    • Medical
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