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  6. XCZU4CG-1FBVB900I
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    Mfr.Part #
    XCZU4CG-1FBVB900I
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    10,782
    In Stock ：
    10,782

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Architecture :
    MCU, FPGA
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Package / Case :
    900-BBGA, FCBGA
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    HTS Code :
    8542.31.00.01
    Number of I/O :
    204
    Packaging :
    Tray
    Operating Temperature :
    -40°C~100°C TJ
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    RoHS Status :
    ROHS3 Compliant
    Peripherals :
    DMA, WDT
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Published :
    2016
    RAM Size :
    256KB
    Factory Lead Time :
    11 Weeks
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Speed :
    500MHz, 1.2GHz
    Datasheets
    XCZU4CG-1FBVB900I
    Introducing System On Chip (SoC) AMD Xilinx XCZU4CG-1FBVB900I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：900-BBGA, FCBGA, Operating Temperature：-40°C~100°C TJ, XCZU4CG-1FBVB900I pinout, XCZU4CG-1FBVB900I datasheet PDF, XCZU4CG-1FBVB900I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU4CG-1FBVB900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU4CG-1FBVB900I


    -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 204 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    A Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC CG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells.Housed in the state-of-art Tray package.204 I/Os in total are included in this SoC part.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU4CG-1FBVB900I System On Chip (SoC) applications.


    • Automotive gateway
    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
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