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  6. XCZU48DR-2FFVE1156I
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    Mfr.Part #
    XCZU48DR-2FFVE1156I
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC ZUP RFSOC A53 FPGA 1156BGA
    Stock
    6,746
    In Stock ：
    6,746

    Request A Quote(RFQ)

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    * Quantity:
    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Data Bus Width :
    64 Bit
    Screening Level :
    Industrial
    Interface Type :
    CAN/Serial I2C/SPI/UART/USB
    Internal Switch(s) :
    Does Not Contain Switch
    Package :
    Tray
    Instruction Set Architecture :
    RISC
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
    Operating Supply Voltage :
    3.4, 5.5 V
    Package / Case :
    1156-BBGA, FCBGA
    Flash Size :
    -
    Contact Material :
    COPPER ALLOY
    Mating Length/Depth :
    --
    Panel Hole Size :
    --
    Industry Recognized Mating Diameter :
    3.20mm ID, 9.00mm OD (RCA)
    Speed :
    533MHz, 1.333GHz
    Contact Material - Plating :
    Tin
    Signal Lines :
    Mono
    Voltage - Rated :
    --
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Cable Opening :
    --
    Series :
    --
    Operating Temperature :
    -20°C ~ 65°C
    Gender :
    FEMALE
    Peripherals :
    DDR, DMA, PCIe
    Body Color :
    Silver
    Thread Size :
    --
    Shielding :
    Unshielded
    Includes :
    --
    Termination :
    Solder
    Interfaces :
    CAN/Serial I2C/SPI/U
    Device Core :
    ARM Cortex-A53/ARM Cortex-R5
    Packaging :
    Bulk
    Connector Type :
    Phono (RCA) Jack
    Housing Material :
    --
    RAM Size :
    256 kb
    Number of Positions/Contacts :
    2 Conductors, 2 Contacts
    Features :
    Mounting Hardware
    Mounting :
    Surface Mount
    JTAG Support :
    yes
    Insulation Color :
    Black
    Number of I/O :
    366
    Mounting Type :
    Through Hole
    Body Material :
    COPPER ALLOY
    Supplier Device Package :
    1156-FCBGA (35x35)
    Product Status :
    Active
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Architecture :
    MCU, FPGA
    Actual Diameter :
    --
    Introducing System On Chip (SoC) AMD Xilinx XCZU48DR-2FFVE1156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1156-BBGA, FCBGA, Operating Temperature：-20°C ~ 65°C, Mounting Type：Through Hole, XCZU48DR-2FFVE1156I pinout, XCZU48DR-2FFVE1156I datasheet PDF, XCZU48DR-2FFVE1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU48DR-2FFVE1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU48DR-2FFVE1156I


    -20°C ~ 65°C System On Chip -- Series 366 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256 KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the -- series of system on a chips.It is recommended that this SoC meaning be operated at -20°C ~ 65°C on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 930K+ Logic Cells together.Bulk package houses this SoC system on a chip.An integral part of this SoC consists of a total of 366 I/Os.As for its flash size, it is -.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256 KB RAM.
    Built on MCU, FPGA.
    - extended flash.


    There are a lot of AMD


    XCZU48DR-2FFVE1156I System On Chip (SoC) applications.


    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
    • Medical
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