XCZU47DR-L2FSVG1517I

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Mfr.Part #
XCZU47DR-L2FSVG1517I
Manufacturer
AMD Xilinx
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC ZUP RFSOC A53 FPGA LP 1517BGA
Stock
18,210
In Stock :
18,210

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Shell Finish :
Olive Drab Cadmium
Package :
Bulk
Series :
MIL-DTL-5015, CA-B
Supplier Device Package :
1517-FCBGA (40x40)
Shielding :
-
Voltage Rating :
50V
Shell Size, MIL :
-
Number of I/O :
561
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Shell Size - Insert :
32-1
Base Product Number :
CA310
Termination :
Solder Cup
Ingress Protection :
IP67 - Dust Tight, Waterproof
Color :
Olive Drab
Speed :
533MHz, 1.333GHz
Current Rating (Amps) :
41A, 245A
Contact Finish Thickness - Mating :
-
Shell Material :
Aluminum Alloy
Primary Material :
Metal
Primary Attributes :
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Peripherals :
DMA, WDT
Package / Case :
1517-BBGA, FCBGA
Contact Finish - Mating :
Silver
Architecture :
MCU, FPGA
Fastening Type :
Reverse Bayonet Lock
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size :
-
Connector Type :
Plug, Female Sockets
Features :
-
Operating Temperature :
-55°C ~ 125°C
RAM Size :
256KB
Mounting Type :
Free Hanging (In-Line)
Orientation :
N (Normal)
Number of Positions :
5
Mounting Feature :
-
Product Status :
Active
Introducing System On Chip (SoC) AMD Xilinx XCZU47DR-L2FSVG1517I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1517-BBGA, FCBGA, Operating Temperature:-55°C ~ 125°C, Mounting Type:Free Hanging (In-Line), XCZU47DR-L2FSVG1517I pinout, XCZU47DR-L2FSVG1517I datasheet PDF, XCZU47DR-L2FSVG1517I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU47DR-L2FSVG1517I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU47DR-L2FSVG1517I


-55°C ~ 125°C System On Chip MIL-DTL-5015, CA-B Series 561 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.There is a 1517-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.MIL-DTL-5015, CA-B is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -55°C ~ 125°C when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 930K+ Logic Cells.As a whole, this SoC part is comprised of 561 inputs and outputs.This flash has a size of -.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
- extended flash.


There are a lot of AMD


XCZU47DR-L2FSVG1517I System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control
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