XCZU47DR-2FSVE1156E

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Mfr.Part #
XCZU47DR-2FSVE1156E
Manufacturer
AMD Xilinx
Package / Case
0805 (2012 Metric)
Datasheet
Download
Description
IC ZUP RFSOC A53 FPGA 1156BGA
Stock
48,157
In Stock :
48,157

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Supplier Device Package :
0805
Height - Seated (Max) :
0.024 (0.60mm)
Base Product Number :
RN732A
Composition :
Thin Film
Product Status :
Obsolete
Number of Terminations :
2
Speed :
533MHz, 1.333GHz
RAM Size :
256KB
Size / Dimension :
0.079 L x 0.049 W (2.00mm x 1.25mm)
Temperature Coefficient :
±25ppm/°C
Package / Case :
0805 (2012 Metric)
Features :
Moisture Resistant
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Power (Watts) :
0.1W, 1/10W
Architecture :
MCU, FPGA
Tolerance :
±0.5%
Peripherals :
DMA, WDT
Flash Size :
-
Primary Attributes :
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Resistance :
1.18 kOhms
Operating Temperature :
-55°C ~ 155°C
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Series :
RN73
Number of I/O :
366
Package :
Tape and Reel (TR)
Introducing System On Chip (SoC) AMD Xilinx XCZU47DR-2FSVE1156E from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:2, Package / Case:0805 (2012 Metric), Operating Temperature:-55°C ~ 155°C, XCZU47DR-2FSVE1156E pinout, XCZU47DR-2FSVE1156E datasheet PDF, XCZU47DR-2FSVE1156E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU47DR-2FSVE1156E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU47DR-2FSVE1156E


2 Terminations -55°C ~ 155°C System On Chip RN73 Series 366 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 0805 (2012 Metric) package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the RN73 series of system on a chips.It is recommended that this SoC meaning be operated at -55°C ~ 155°C on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 930K+ Logic Cells together.An integral part of this SoC consists of a total of 366 I/Os.The system on a chip uses 2 terminations in total.As for its flash size, it is -.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
- extended flash.


There are a lot of Xilinx


XCZU47DR-2FSVE1156E System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
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