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    Mfr.Part #
    XCZU47DR-2FFVE1156E
    Manufacturer
    AMD Xilinx
    Package / Case
    1156-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC ZUP RFSOC A53 FPGA 1156BGA
    Stock
    32,337
    In Stock ：
    32,337

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Architecture :
    MCU, FPGA
    Base Product Number :
    CIR06
    Flash Size :
    -
    Package / Case :
    1156-BBGA, FCBGA
    Operating Temperature :
    0°C ~ 100°C (TJ)
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Supplier Device Package :
    1156-FCBGA (35x35)
    Number of I/O :
    366
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
    Peripherals :
    DMA, WDT
    Speed :
    533MHz, 1.333GHz
    Series :
    *
    Product Status :
    Active
    Package :
    Bulk
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    RAM Size :
    256KB
    Introducing System On Chip (SoC) AMD Xilinx XCZU47DR-2FFVE1156E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1156-BBGA, FCBGA, Operating Temperature：0°C ~ 100°C (TJ), XCZU47DR-2FFVE1156E pinout, XCZU47DR-2FFVE1156E datasheet PDF, XCZU47DR-2FFVE1156E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU47DR-2FFVE1156E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU47DR-2FFVE1156E


    0°C ~ 100°C (TJ) System On Chip * Series 366 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    A core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 1156-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.* is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C ~ 100°C (TJ).This SoC security combines Zynq®UltraScale+™ FPGA, 930K+ Logic Cells, an important feature to keep in mind.366 I/Os are available in this SoC part.The flash size of the SoC meaning is -.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    - extended flash.


    There are a lot of Xilinx


    XCZU47DR-2FFVE1156E System On Chip (SoC) applications.


    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
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