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  6. XCZU46DR-2FFVH1760I
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    XCZU46DR-2FFVH1760I

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    Mfr.Part #
    XCZU46DR-2FFVH1760I
    Manufacturer
    AMD Xilinx
    Package / Case
    1760-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC ZUP RFSOC A53 FPGA 1760BGA
    Stock
    10,872
    In Stock ：
    10,872

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Package :
    Tray
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Series :
    Zynq® UltraScale+™ RFSoC
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
    Product Status :
    Active
    Package / Case :
    1760-BBGA, FCBGA
    Supplier Device Package :
    1760-FCBGA (42.5x42.5)
    RAM Size :
    256KB
    Flash Size :
    -
    Number of I/O :
    574
    Subcategory :
    D-Sub Connectors
    Speed :
    533MHz, 1.333GHz
    Product Category :
    D-Sub Mixed Contact Connectors
    Brand :
    Amphenol Positronic
    Product Type :
    Mixed Contact D-Sub Connectors
    Architecture :
    MCU, FPGA
    Peripherals :
    DDR, DMA, PCIe
    Operating Temperature :
    -40°C ~ 100°C (TJ)
    Manufacturer :
    Positronic
    Introducing System On Chip (SoC) AMD Xilinx XCZU46DR-2FFVH1760I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：1760-BBGA, FCBGA, Operating Temperature：-40°C ~ 100°C (TJ), XCZU46DR-2FFVH1760I pinout, XCZU46DR-2FFVH1760I datasheet PDF, XCZU46DR-2FFVH1760I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU46DR-2FFVH1760I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU46DR-2FFVH1760I


    -40°C ~ 100°C (TJ) System On Chip Zynq® UltraScale+™ RFSoC Series 574 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC is built.Package 1760-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq® UltraScale+™ RFSoC.This SoC meaning should have an average operating temperature of -40°C ~ 100°C (TJ).It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 930K+ Logic Cells.574 I/Os are included in this SoC part.This system on a chip is just as capable as any other high-quality D-Sub Connectors.A - flash can be seen on it.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.
    - extended flash.


    There are a lot of Xilinx


    XCZU46DR-2FFVH1760I System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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