XCZU43DR-L1FFVE1156I

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Mfr.Part #
XCZU43DR-L1FFVE1156I
Manufacturer
AMD Xilinx
Package / Case
1156-BBGA, FCBGA
Datasheet
Download
Description
IC ZUP RFSOC A53 FPGA LP 1156BGA
Stock
11,256
In Stock :
11,256

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Supplier Device Package :
1156-FCBGA (35x35)
Speed :
500MHz, 1.2GHz
Connectivity :
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
RoHS :
Y
Product Status :
Active
Package / Case :
1156-BBGA, FCBGA
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Mounting Type :
Terminal: ¼in Combos: 2, 3 or 4, Ground Lug
RAM Size :
256KB
Operating Temperature :
-40°C ~ 100°C (TJ)
Package :
Tray
Peripherals :
DDR, DMA, PCIe
Series :
Zynq® UltraScale+™ RFSoC
Flash Size :
-
Manufacturer :
BARKER MICROFARADS INC
Packaging :
2.156in x 1.312in Oval Case
Voltage :
370VAC
Primary Attributes :
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Number of I/O :
366
Tolerance :
±3%
Architecture :
MCU, FPGA
Capacitance :
405uF
Introducing System On Chip (SoC) AMD Xilinx XCZU43DR-L1FFVE1156I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1156-BBGA, FCBGA, Mounting Type:Terminal: ¼in Combos: 2, 3 or 4, Ground Lug, Operating Temperature:-40°C ~ 100°C (TJ), Voltage:370VAC, XCZU43DR-L1FFVE1156I pinout, XCZU43DR-L1FFVE1156I datasheet PDF, XCZU43DR-L1FFVE1156I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU43DR-L1FFVE1156I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU43DR-L1FFVE1156I


-40°C ~ 100°C (TJ) System On Chip Zynq® UltraScale+™ RFSoC Series 366 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ RFSoC series.The average operating temps for this SoC meaning should be -40°C ~ 100°C (TJ).One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 930K+ Logic Cells.Housed in the state-of-art 2.156in x 1.312in Oval Case package.366 I/Os in total are included in this SoC part.It has a - flash.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
- extended flash.


There are a lot of Xilinx


XCZU43DR-L1FFVE1156I System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
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