XCZU3EG-2SFVA625I

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Mfr.Part #
XCZU3EG-2SFVA625I
Manufacturer
AMD Xilinx
Package / Case
625-BFBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 625FCBGA
Stock
18,048
In Stock :
18,048

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Series :
Zynq® UltraScale+™ MPSoC EG
RoHS Status :
ROHS3 Compliant
Terminal Form :
Ball
Surface Mount :
yes
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage :
0.85V
Supply Voltage-Min (Vsup) :
0.825V
Factory Lead Time :
11 Weeks
Primary Attributes :
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Operating Temperature :
-40°C~100°C TJ
Number of I/O :
180
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Published :
2016
Peripherals :
DMA, WDT
Package / Case :
625-BFBGA, FCBGA
Packaging :
Tray
HTS Code :
8542.31.00.01
Terminal Position :
BOTTOM
JESD-30 Code :
R-PBGA-B625
RAM Size :
256KB
Number of Terminations :
625
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Architecture :
MCU, FPGA
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Supply Voltage-Max (Vsup) :
0.876V
Speed :
533MHz, 600MHz, 1.3GHz
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Datasheets
XCZU3EG-2SFVA625I
Introducing System On Chip (SoC) AMD Xilinx XCZU3EG-2SFVA625I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:625-BFBGA, FCBGA, Number of Terminations:625, XCZU3EG-2SFVA625I pinout, XCZU3EG-2SFVA625I datasheet PDF, XCZU3EG-2SFVA625I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU3EG-2SFVA625I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU3EG-2SFVA625I


625 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 180 I/O 0.85V

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 625-BFBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.Housed in the state-of-art Tray package.180 I/Os in total are included in this SoC part.It is advised to utilize a 0.85V power supply.For the SoCs wireless, a voltage higher than 0.876V is considered unsafe.It can feed on a power supply of at least 0.825V.There are 625 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU3EG-2SFVA625I System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
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