XCZU3EG-2SFVA625I
- Mfr.Part #
- XCZU3EG-2SFVA625I
- Manufacturer
- AMD Xilinx
- Package / Case
- 625-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A53 625FCBGA
- Stock
- 18,048
- In Stock :
- 18,048
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Series :
- Zynq® UltraScale+™ MPSoC EG
- RoHS Status :
- ROHS3 Compliant
- Terminal Form :
- Ball
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage :
- 0.85V
- Supply Voltage-Min (Vsup) :
- 0.825V
- Factory Lead Time :
- 11 Weeks
- Primary Attributes :
- Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
- Operating Temperature :
- -40°C~100°C TJ
- Number of I/O :
- 180
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Published :
- 2016
- Peripherals :
- DMA, WDT
- Package / Case :
- 625-BFBGA, FCBGA
- Packaging :
- Tray
- HTS Code :
- 8542.31.00.01
- Terminal Position :
- BOTTOM
- JESD-30 Code :
- R-PBGA-B625
- RAM Size :
- 256KB
- Number of Terminations :
- 625
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Architecture :
- MCU, FPGA
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Supply Voltage-Max (Vsup) :
- 0.876V
- Speed :
- 533MHz, 600MHz, 1.3GHz
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Datasheets
- XCZU3EG-2SFVA625I
625 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 180 I/O 0.85V
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 625-BFBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.Housed in the state-of-art Tray package.180 I/Os in total are included in this SoC part.It is advised to utilize a 0.85V power supply.For the SoCs wireless, a voltage higher than 0.876V is considered unsafe.It can feed on a power supply of at least 0.825V.There are 625 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU3EG-2SFVA625I System On Chip (SoC) applications.
- Automotive gateway
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
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