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    XCZU3EG-1UBVA530E

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    Mfr.Part #
    XCZU3EG-1UBVA530E
    Manufacturer
    AMD Xilinx
    Package / Case
    FBGA-530
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 530BGA
    Stock
    2,271
    In Stock ：
    2,271

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Number of Cores :
    7 Core
    Number of I/Os :
    82 I/O
    Number of I/O :
    82
    Series :
    -
    Product Status :
    Active
    Package / Case :
    FBGA-530
    Peripherals :
    DMA, WDT
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
    Flash Size :
    -
    Architecture :
    MPU, FPGA
    Maximum Operating Temperature :
    + 100 C
    Speed :
    500MHz, 1.2GHz
    Mounting Style :
    SMD/SMT
    Minimum Operating Temperature :
    0 C
    Supplier Device Package :
    530-FCBGA (16x9.5)
    Operating Temperature :
    0°C ~ 100°C (TJ)
    RAM Size :
    256KB
    Package :
    Tray
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Operating Supply Voltage :
    850 mV
    Datasheets
    XCZU3EG-1UBVA530E
    Introducing System On Chip (SoC) AMD Xilinx XCZU3EG-1UBVA530E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：FBGA-530, Operating Temperature：0°C ~ 100°C (TJ), XCZU3EG-1UBVA530E pinout, XCZU3EG-1UBVA530E datasheet PDF, XCZU3EG-1UBVA530E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU3EG-1UBVA530E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU3EG-1UBVA530E


    0°C ~ 100°C (TJ) System On Chip - Series 82 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC is built.Package FBGA-530 is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MPU, FPGA technique for its internal architecture.The system on a chip is part of the series -.This SoC meaning should have an average operating temperature of 0°C ~ 100°C (TJ).It is important to note that this SoC security combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.82 I/Os are included in this SoC part.A - flash can be seen on it.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MPU, FPGA.
    - extended flash.


    There are a lot of Xilinx


    XCZU3EG-1UBVA530E System On Chip (SoC) applications.


    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
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