XCZU3CG-L1SBVA484I

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Mfr.Part #
XCZU3CG-L1SBVA484I
Manufacturer
AMD Xilinx
Package / Case
484-BFBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 484FCBGA
Stock
21,953
In Stock :
21,953

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Published :
2016
Core Processor :
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Primary Attributes :
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Package / Case :
484-BFBGA, FCBGA
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Terminations :
484
Architecture :
MCU, FPGA
RoHS Status :
ROHS3 Compliant
JESD-30 Code :
R-PBGA-B484
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Peripherals :
DMA, WDT
Terminal Form :
Ball
Supply Voltage-Min (Vsup) :
0.698V
Number of I/O :
82
Series :
Zynq® UltraScale+™ MPSoC CG
HTS Code :
8542.31.00.01
Surface Mount :
yes
Supply Voltage-Max (Vsup) :
0.742V
Supply Voltage :
0.72V
Terminal Position :
BOTTOM
Packaging :
Tray
Operating Temperature :
-40°C~100°C TJ
Speed :
500MHz, 1.2GHz
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
11 Weeks
RAM Size :
256KB
Additional Feature :
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Introducing System On Chip (SoC) AMD Xilinx XCZU3CG-L1SBVA484I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:484-BFBGA, FCBGA, Number of Terminations:484, Operating Temperature:-40°C~100°C TJ, XCZU3CG-L1SBVA484I pinout, XCZU3CG-L1SBVA484I datasheet PDF, XCZU3CG-L1SBVA484I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU3CG-L1SBVA484I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU3CG-L1SBVA484I


484 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 82 I/O 0.72V

This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


There are Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processors in this SoC.This system on a chip is packaged as 484-BFBGA, FCBGA by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq® UltraScale+™ MPSoC CG series contains this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.There is one thing to note about this SoC security: it combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part has a total of 82 I/Os.A power supply with a 0.72V rating is recommended.There is no safe voltage for the SoCs wireless above 0.742V.Power supply should be at least 0.698V.It is really beneficial to have system on a chip since there are 484 terminations in total.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU3CG-L1SBVA484I System On Chip (SoC) applications.


  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
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