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    XCZU3CG-2UBVA530I

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    Mfr.Part #
    XCZU3CG-2UBVA530I
    Manufacturer
    AMD Xilinx
    Package / Case
    FBGA-530
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 530BGA
    Stock
    18,302
    In Stock ：
    18,302

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Number of I/O :
    82
    Operating Supply Voltage :
    850 mV
    Peripherals :
    DMA, WDT
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
    Product Status :
    Active
    Maximum Operating Temperature :
    + 100 C
    Speed :
    533MHz, 1.3GHz
    Series :
    -
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Flash Size :
    -
    Supplier Device Package :
    530-FCBGA (16x9.5)
    Minimum Operating Temperature :
    - 40 C
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Number of Cores :
    4 Core
    Number of I/Os :
    82 I/O
    Package / Case :
    FBGA-530
    Operating Temperature :
    -40°C ~ 100°C (TJ)
    Mounting Style :
    SMD/SMT
    RAM Size :
    256KB
    Architecture :
    MPU, FPGA
    Package :
    Tray
    Datasheets
    XCZU3CG-2UBVA530I
    Introducing System On Chip (SoC) AMD Xilinx XCZU3CG-2UBVA530I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：FBGA-530, Operating Temperature：-40°C ~ 100°C (TJ), XCZU3CG-2UBVA530I pinout, XCZU3CG-2UBVA530I datasheet PDF, XCZU3CG-2UBVA530I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU3CG-2UBVA530I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU3CG-2UBVA530I


    -40°C ~ 100°C (TJ) System On Chip - Series 82 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package FBGA-530 to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MPU, FPGA technique.In the - series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C ~ 100°C (TJ).Taking note of the fact that this SoC security combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells is important.In total, this SoC part has 82 I/Os.A flashing - appears on it.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MPU, FPGA.
    - extended flash.


    There are a lot of Xilinx


    XCZU3CG-2UBVA530I System On Chip (SoC) applications.


    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
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