XCZU3CG-2SBVA484I

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Mfr.Part #
XCZU3CG-2SBVA484I
Manufacturer
AMD Xilinx
Package / Case
484-BFBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 484FCBGA
Stock
34,425
In Stock :
34,425

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Supply Voltage :
0.85V
Packaging :
Tray
Peripherals :
DMA, WDT
RoHS Status :
ROHS3 Compliant
Series :
Zynq® UltraScale+™ MPSoC CG
Core Processor :
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature :
-40°C~100°C TJ
Terminal Form :
Ball
RAM Size :
256KB
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Number of I/O :
82
HTS Code :
8542.31.00.01
Published :
2016
Supply Voltage-Max (Vsup) :
0.876V
Package / Case :
484-BFBGA, FCBGA
Architecture :
MCU, FPGA
Speed :
533MHz, 1.3GHz
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Primary Attributes :
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
JESD-30 Code :
R-PBGA-B484
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Surface Mount :
yes
Factory Lead Time :
11 Weeks
Number of Terminations :
484
Terminal Position :
BOTTOM
Datasheets
XCZU3CG-2SBVA484I
Introducing System On Chip (SoC) AMD Xilinx XCZU3CG-2SBVA484I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:484-BFBGA, FCBGA, Number of Terminations:484, XCZU3CG-2SBVA484I pinout, XCZU3CG-2SBVA484I datasheet PDF, XCZU3CG-2SBVA484I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU3CG-2SBVA484I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU3CG-2SBVA484I


484 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 82 I/O 0.85V

This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.There is a 484-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+™ MPSoC CG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 82 inputs and outputs.Ideally, a power supply with a voltage of 0.85V should be used.An excessive voltage of 0.876V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.system on a chip benefits from 484 terminations.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU3CG-2SBVA484I System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control
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