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  6. XCZU3CG-1UBVA530I
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    XCZU3CG-1UBVA530I

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    Mfr.Part #
    XCZU3CG-1UBVA530I
    Manufacturer
    AMD Xilinx
    Package / Case
    FBGA-530
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 530BGA
    Stock
    35,866
    In Stock ：
    35,866

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Mounting Style :
    SMD/SMT
    Number of I/Os :
    82 I/O
    Speed :
    500MHz, 1.2GHz
    Operating Supply Voltage :
    850 mV
    Peripherals :
    DMA, WDT
    Number of Cores :
    4 Core
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
    Supplier Device Package :
    530-FCBGA (16x9.5)
    Maximum Operating Temperature :
    + 100 C
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Number of I/O :
    82
    Flash Size :
    -
    Operating Temperature :
    -40°C ~ 100°C (TJ)
    Minimum Operating Temperature :
    - 40 C
    Package / Case :
    FBGA-530
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    RAM Size :
    256KB
    Product Status :
    Active
    Architecture :
    MPU, FPGA
    Datasheets
    XCZU3CG-1UBVA530I
    Introducing System On Chip (SoC) AMD Xilinx XCZU3CG-1UBVA530I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C ~ 100°C (TJ), Package / Case：FBGA-530, XCZU3CG-1UBVA530I pinout, XCZU3CG-1UBVA530I datasheet PDF, XCZU3CG-1UBVA530I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU3CG-1UBVA530I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU3CG-1UBVA530I


    -40°C ~ 100°C (TJ) System On Chip 82 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    A Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a FBGA-530 package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MPU, FPGA technique.The average operating temps for this SoC meaning should be -40°C ~ 100°C (TJ).One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.82 I/Os in total are included in this SoC part.It has a - flash.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MPU, FPGA.
    - extended flash.


    There are a lot of Xilinx


    XCZU3CG-1UBVA530I System On Chip (SoC) applications.


    • Automotive gateway
    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
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