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    XCZU3CG-1UBVA530E

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    Mfr.Part #
    XCZU3CG-1UBVA530E
    Manufacturer
    AMD Xilinx
    Package / Case
    FBGA-530
    Datasheet
    Download
    Description
    IC ZUP MPSOC A53 FPGA 530BGA
    Stock
    35,186
    In Stock ：
    35,186

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Flash Size :
    -
    Series :
    Zynq® UltraScale+™ MPSoC CG
    Maximum Operating Temperature :
    + 100 C
    Number of I/O :
    82
    Package :
    Tray
    Minimum Operating Temperature :
    0 C
    Speed :
    500MHz, 1.2GHz
    Number of Cores :
    4 Core
    Mounting Style :
    SMD/SMT
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Peripherals :
    DMA, WDT
    Package / Case :
    FBGA-530
    Operating Temperature :
    0°C ~ 100°C (TJ)
    Operating Supply Voltage :
    850 mV
    Architecture :
    MPU, FPGA
    Supplier Device Package :
    530-FCBGA (16x9.5)
    RAM Size :
    256KB
    Number of I/Os :
    82 I/O
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
    Product Status :
    Active
    Datasheets
    XCZU3CG-1UBVA530E
    Introducing System On Chip (SoC) AMD Xilinx XCZU3CG-1UBVA530E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：FBGA-530, Operating Temperature：0°C ~ 100°C (TJ), XCZU3CG-1UBVA530E pinout, XCZU3CG-1UBVA530E datasheet PDF, XCZU3CG-1UBVA530E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU3CG-1UBVA530E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU3CG-1UBVA530E


    0°C ~ 100°C (TJ) System On Chip Zynq® UltraScale+™ MPSoC CG Series 82 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    A core processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ is used to build this SoC.Its package is FBGA-530.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MPU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC CG series.For this SoC meaning, the average operating temperature should be 0°C ~ 100°C (TJ).A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells.Total I/Os on this SoC part are 82.There is a flash of -.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MPU, FPGA.
    - extended flash.


    There are a lot of Xilinx


    XCZU3CG-1UBVA530E System On Chip (SoC) applications.


    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
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