XCZU2EG-L2SFVC784E
- Mfr.Part #
- XCZU2EG-L2SFVC784E
- Manufacturer
- AMD Xilinx
- Package / Case
- 784-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A53 784FCBGA
- Stock
- 46,764
- In Stock :
- 46,764
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Terminal Position :
- BOTTOM
- RoHS Status :
- ROHS3 Compliant
- Number of Terminations :
- 784
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Surface Mount :
- yes
- RAM Size :
- 256KB
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Package / Case :
- 784-BFBGA, FCBGA
- Supply Voltage :
- 0.72V
- Supply Voltage-Max (Vsup) :
- 0.742V
- Additional Feature :
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- Factory Lead Time :
- 11 Weeks
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Primary Attributes :
- Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
- Peripherals :
- DMA, WDT
- Operating Temperature :
- 0°C~100°C TJ
- Packaging :
- Tray
- JESD-30 Code :
- R-PBGA-B784
- Architecture :
- MCU, FPGA
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Series :
- Zynq® UltraScale+™ MPSoC EG
- Core Processor :
- Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Terminal Form :
- Ball
- Supply Voltage-Min (Vsup) :
- 0.698V
- Number of I/O :
- 252
- HTS Code :
- 8542.31.00.01
- Published :
- 2013
- Speed :
- 533MHz, 600MHz, 1.3GHz
- Datasheets
- XCZU2EG-L2SFVC784E

784 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 252 I/O 0.72V
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC has been developed.There is a 784-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+™ MPSoC EG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 252 inputs and outputs.Ideally, a power supply with a voltage of 0.72V should be used.An excessive voltage of 0.742V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 0.698V, it should be able to function.system on a chip benefits from 784 terminations.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.Aside from that, this SoC processor is also equipped with some additional features that are present in ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
There are a lot of Xilinx Inc.
XCZU2EG-L2SFVC784E System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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