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  6. XCZU2CG-L2UBVA530E
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    XCZU2CG-L2UBVA530E

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    Mfr.Part #
    XCZU2CG-L2UBVA530E
    Manufacturer
    AMD Xilinx
    Package / Case
    FBGA-530
    Datasheet
    Download
    Description
    IC ZUP MPSOC A53 FPGA LP 530BGA
    Stock
    3,533
    In Stock ：
    3,533

    Request A Quote(RFQ)

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Number of I/O :
    82
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
    Number of I/Os :
    82 I/O
    Flash Size :
    -
    Minimum Operating Temperature :
    0 C
    Operating Supply Voltage :
    850 mV
    Architecture :
    MPU, FPGA
    Number of Cores :
    4 Core
    Package / Case :
    FBGA-530
    Supplier Device Package :
    530-FCBGA (16x9.5)
    Peripherals :
    DMA, WDT
    Product Status :
    Active
    Speed :
    533MHz, 1.3GHz
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    RAM Size :
    256KB
    Maximum Operating Temperature :
    + 110 C
    Core Processor :
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Mounting Style :
    SMD/SMT
    Operating Temperature :
    0°C ~ 100°C (TJ)
    Introducing System On Chip (SoC) AMD Xilinx XCZU2CG-L2UBVA530E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case：FBGA-530, Operating Temperature：0°C ~ 100°C (TJ), XCZU2CG-L2UBVA530E pinout, XCZU2CG-L2UBVA530E datasheet PDF, XCZU2CG-L2UBVA530E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU2CG-L2UBVA530E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU2CG-L2UBVA530E


    0°C ~ 100°C (TJ) System On Chip 82 I/O

    This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.There is a FBGA-530 package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MPU, FPGA technique is used for the SoC design's internal architecture.This SoC meaning should have an average operating temperature of 0°C ~ 100°C (TJ) when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.As a whole, this SoC part is comprised of 82 inputs and outputs.This flash has a size of -.

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MPU, FPGA.
    - extended flash.


    There are a lot of Xilinx


    XCZU2CG-L2UBVA530E System On Chip (SoC) applications.


    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
    • Healthcare
    • Medical
    • Remote control
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