XCZU2CG-2SBVA484I

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Mfr.Part #
XCZU2CG-2SBVA484I
Manufacturer
AMD Xilinx
Package / Case
484-BFBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 484FCBGA
Stock
18,114
In Stock :
18,114

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Terminal Form :
Ball
Core Processor :
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Surface Mount :
yes
RoHS Status :
ROHS3 Compliant
Package / Case :
484-BFBGA, FCBGA
uPs/uCs/Peripheral ICs Type :
MICROPROCESSOR CIRCUIT
Speed :
533MHz, 1.3GHz
HTS Code :
8542.31.00.01
Number of Terminations :
484
Primary Attributes :
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
RAM Size :
256KB
Supply Voltage :
0.85V
Published :
2016
Terminal Position :
BOTTOM
Architecture :
MCU, FPGA
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature :
-40°C~100°C TJ
Supply Voltage-Max (Vsup) :
0.876V
Number of I/O :
82
Peripherals :
DMA, WDT
Factory Lead Time :
11 Weeks
JESD-30 Code :
R-PBGA-B484
Series :
Zynq® UltraScale+™ MPSoC CG
Packaging :
Tray
Datasheets
XCZU2CG-2SBVA484I
Introducing System On Chip (SoC) AMD Xilinx XCZU2CG-2SBVA484I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:484-BFBGA, FCBGA, Number of Terminations:484, Operating Temperature:-40°C~100°C TJ, XCZU2CG-2SBVA484I pinout, XCZU2CG-2SBVA484I datasheet PDF, XCZU2CG-2SBVA484I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU2CG-2SBVA484I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU2CG-2SBVA484I


484 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 82 I/O 0.85V

This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BFBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq® UltraScale+™ MPSoC CG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 82 I/Os.Use a power supply with a voltage of 0.85V if possible.It is unsafe to operate the SoCs wireless at voltages above 0.876V.A system on a chip benefits from having 484 terminations.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XCZU2CG-2SBVA484I System On Chip (SoC) applications.


  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
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