XCZU19EG-3FFVC1760E

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Mfr.Part #
XCZU19EG-3FFVC1760E
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1760FCBGA
Stock
44,429
In Stock :
44,429

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
HTS Code :
8542.31.00.01
Package / Case :
1760-BBGA, FCBGA
Packaging :
Tray
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Published :
2016
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Architecture :
MCU, FPGA
Peripherals :
DMA, WDT
Number of I/O :
512
RoHS Status :
ROHS3 Compliant
Speed :
600MHz, 667MHz, 1.5GHz
Series :
Zynq® UltraScale+™ MPSoC EG
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Factory Lead Time :
11 Weeks
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature :
0°C~100°C TJ
RAM Size :
256KB
Primary Attributes :
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Introducing System On Chip (SoC) AMD Xilinx XCZU19EG-3FFVC1760E from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1760-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, XCZU19EG-3FFVC1760E pinout, XCZU19EG-3FFVC1760E datasheet PDF, XCZU19EG-3FFVC1760E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU19EG-3FFVC1760E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 512 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 1760-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 512.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU19EG-3FFVC1760E System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
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