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XCZU19EG-2FFVC1760I

XCZU19EG-2FFVC1760I

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Mfr.Part #
XCZU19EG-2FFVC1760I
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1760FCBGA
Stock
1,131
In Stock ：
1,131

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Number of I/O :
512
HTS Code :
8542.31.00.01
Operating Temperature :
-40°C~100°C TJ
Packaging :
Tray
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Architecture :
MCU, FPGA
RoHS Status :
ROHS3 Compliant
Series :
Zynq® UltraScale+™ MPSoC EG
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed :
533MHz, 600MHz, 1.3GHz
RAM Size :
256KB
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Package / Case :
1760-BBGA, FCBGA
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes :
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Peripherals :
DMA, WDT
Factory Lead Time :
11 Weeks
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Published :
2016
Introducing System On Chip (SoC) AMD Xilinx XCZU19EG-2FFVC1760I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：-40°C~100°C TJ, Package / Case：1760-BBGA, FCBGA, XCZU19EG-2FFVC1760I pinout, XCZU19EG-2FFVC1760I datasheet PDF, XCZU19EG-2FFVC1760I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU19EG-2FFVC1760I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 512 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, this SoC has been developed.The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq® UltraScale+™ MPSoC EG series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 512 I/Os.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU19EG-2FFVC1760I System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
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