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XCZU19EG-1FFVC1760E

XCZU19EG-1FFVC1760E

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Mfr.Part #
XCZU19EG-1FFVC1760E
Manufacturer
AMD Xilinx
Package / Case
1760-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 1760FCBGA
Stock
44,910
In Stock ：
44,910

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
HTS Code :
8542.31.00.01
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
RoHS Status :
ROHS3 Compliant
Factory Lead Time :
11 Weeks
RAM Size :
256KB
Number of I/O :
512
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature :
0°C~100°C TJ
Peripherals :
DMA, WDT
Published :
2016
Speed :
500MHz, 600MHz, 1.2GHz
Packaging :
Tray
Primary Attributes :
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Series :
Zynq® UltraScale+™ MPSoC EG
Architecture :
MCU, FPGA
Package / Case :
1760-BBGA, FCBGA
Introducing System On Chip (SoC) AMD Xilinx XCZU19EG-1FFVC1760E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：1760-BBGA, FCBGA, XCZU19EG-1FFVC1760E pinout, XCZU19EG-1FFVC1760E datasheet PDF, XCZU19EG-1FFVC1760E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU19EG-1FFVC1760E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.



0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 512 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EG series.The average operating temps for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells.Housed in the state-of-art Tray package.512 I/Os in total are included in this SoC part.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU19EG-1FFVC1760E System On Chip (SoC) applications.


  • Automotive gateway
  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
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